1998.05 Rensselaer Polytechnic Institute, Materials Science and Engineering (Ph.D.)
1993.05 Massachusetts Institute of Technology, Materials Science and Engineering (M.S.)
1991.12 Rensselaer Polytechnic Institute, Materials Science and Engineering (B.S.)
◾ Effect of Process and Design Parameters in Cu/SiCN Hybrid Bonding Process: A Finite Element Analysis Study, IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY,, No.15 pp.2492~2500, 2025김사라은경
◾ Electroless Pd Nanolayers for Low-Temperature Hybrid Cu Bonding Application: Comparative Analysis with Electroplated Pd Nanolayers, ELECTRONICS, vol.14 No.19, 2025김사라은경
◾ Characterization of Thermal Conductance of Copper-to-Copper Bonded Interconnects with Metal Passivation for Three-Dimensional Integration, ELECTRONIC MATERIALS LETTERS, vol.21 No.6 pp.829~842, 2025김사라은경
◾ Effects of Au Passivation Thickness on Improving Low-Temperature Cu-to-Cu Bonding Interface, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, vol.15 No.6 pp.1351~1358, 2025김사라은경
◾ C2H4 reductive plasma treatment on copper surface for copper bonding, MATERIALS RESEARCH EXPRESS, vol.12 No.5, 2025김사라은경
◾ Layout Design Strategies for Scaling Down Semiconductor Systems Based on Current Flow Analysis in Interconnect, APPLIED SCIENCES-BASEL, vol.15 No.7, 2025김사라은경
◾ Effect of Ar/N2 Two-Step Plasma Treatments on the Interfacial Characteristics of Low-Temperature Cu-Cu Direct Bonding, ELECTRONIC MATERIALS LETTERS, vol.21 No.3 pp.429~442, 2025김사라은경
◾ Characteristics of PVD SiCN for Application in Hybrid Cu Bonding, JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE, vol.25 No.1 pp.102~108, 2025김사라은경
◾ Understanding and Optimizing Oxygen Plasma Treatment for Enhanced Cu-Cu Bonding Application, IEEE ACCESS, vol.13 pp.20160~20170, 2025김사라은경
Faculty
