About DSE
(Department of Semiconductor Engineering)
교수소개
이름
김사라은경
전공
반도체공정, 첨단반도체패키징
TEL
02-970-6599
E-mail
eunkyung@seoultech.ac.kr
연구실
창조관 522호
학력
1998.05 Rensselaer Polytechnic Institute, Materials Science and Engineering (Ph.D.)
1993.05 Massachusetts Institute of Technology, Materials Science and Engineering (M.S.)
1991.12 Rensselaer Polytechnic Institute, Materials Science and Engineering (B.S.)
주요 경력
2007 – Present Seoul National Univ. of Science and Technology (Professor)
2022 – 2024 Advanced Semiconductor Center at Seoul Tech (Director)
2020 – Present ELOHIM Inc. (Ressearch Director)
2021 – 2023 National Research Foundation of Korea (Review Board)
2021 – 2023 Intellectual Property Trial and Appeal Board (Technical advisor)
2018 – 2020 Technical Consultant at TSE
2014 – 2015 Technical Consultant at SK Hynix
2005 – 2007 Korea Institute of Science and Technology (Sr. Scientist)
1998 – 2005 Intel (Engineering Manager)
1994 – 1994 Samsung Electronics (Engineer)
연구 분야
Advanced Semiconductor Packaging
Semiconductor Processing
Electronic Materials
저널 논문
◾ Low-Temperature Diffusion of Au and Ag Nanolayers for Cu Bonding, applied sciences, No.14 pp.14701~14711, 2024김사라은경
학술대회
◾ Sangmin Lee, Sangwoo Park, and Sarah Eunkyung Kim, Utilization of Au passivation nanolayer for low-temperature Cu-to-Cu bonding, IEEE IMPACT 2025 proceeding, 대만, 2024김사라은경
◾ 정광휘, 권윤후, 김서영, 황찬우, 김사라은경, 웨이퍼 레벨 3D 적층 메모리 제조의 수율 효율성에 관한 연구, 한국반도체학술대회, 경주화백컨벤션센터, 2024김사라은경
◾ 임동현, 김민재, 권범성, 김혜교, 안종현, 김사라은경, 구리/옥사이드 하이브리드 본딩 전 다양한 플라즈마 영향 연구, 한국반도체학술대회, 경주화백컨벤션센터, 2024김사라은경
◾ So-Yeon Park, Cha-Hee Kim, Gwang-Sik Oh, Young Su Yun, Jiho Kang, Sarah Eunkyung Kim, and Won-Jun Lee, Effect of Cu pad geometry and dishing in Cu/SiCN hybrid bonding process: A finite element analysis study, 24th ECS program (on-line), Gothenburg, Sweden, 2023김사라은경
수상
◾ Potential use of fly cutting method for Cu/polymer planarization in hybrid bonding, 현장우수포스터상, 한국반도체학술대회, 2024김사라은경
◾ Quantitative interfacial adhesion energy measurement of Cu-Cu and SiO2-SiO2 bonding interface for hybrid bonding applications, Best Paper Award, International Symposium on Microelectronics and Packaging, 2023김사라은경
◾ 하이브리드 본딩을 위한 SiO2의 Ar/N2 2단계 플라즈마 전처리, 우수 포스터 발표상, 한국 마이크로전자 및 패키징 학술대회 (KMEPS), 2023김사라은경
[01811] 서울 노원구 공릉로 232 서울과학기술대학교 상상관 419호 지능형반도체공학과
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